Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

Preparation and properties of high-performance polyethersulfone composites reinforced by modified silicon nitride - Zhongming Dai, Shiyang Zhu, Shanyou Liu, Shaowei Guan, 2012

Panel Process for Fan Out Wafer Level Packaging: Part Three, Film Epoxy Mold Compounds - Polymer Innovation Blog

P-V-T-C equation for epoxy molding compound

List of Henkel Epoxy Coating Powders and Molding Compounds sold to SolEpoxy

Thermal Behavior of Thermoset Molding Compounds Used to Encapsulate IC Devices

Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound - ScienceDirect

Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)

Warpage Prediction at the Mold Temperature --- Is it a MYTH? Part I

High thermal conductivity of boron nitride filled epoxy composites